PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, BLACK MATRIX AND IMAGE DISPLAY DEVICE
» Número: WO2019004365A1 (A1)
» Fecha Publicación: 03/01/2019
» Solicitante: MITSUBISHI CHEM CORP?[JP]
» Inventor: UEMATSU TAKUYA?[JP]; SEKIGUCHI NAOTO?[JP]
Provided is a photosensitive resin composition which exhibits excellent adhesion to a substrate and is capable of suppressing and controlling line width change during high temperature processing. A photosensitive resin composition according to the present invention contains (a) an alkali-soluble resin, (b) a photopolymerizable monomer, (c) a radical photopolymerization initiator, (d) an organosilicon compound and (e) a colorant. This photosensitive resin composition is characterized in that: the alkali-soluble resin (a) contains an epoxy (meth)acrylate resin that has a carboxyl group; and the organosilicon compound (d) contains an organosilicon vinyl polymer (d-1) that has a repeating unit represented by general formula (1).